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| PRELIMINARY CY7C60445, CY7C6045x enCoReTM V Low Voltage Microcontroller Features Powerful Harvard Architecture Processor M8C Processor speeds running up to 24 MHz Low power at high processing speeds Interrupt controller 1.71V to 3.6V operating voltage Temperature range: 0C to 70C Flexible On-Chip Memory Up to 32K Flash program storage 50,000 Erase/write cycles Up to 2048 bytes SRAM data storage Flexible protection modes In-System Serial Programming (ISSP) Complete Development Tools Free development tool (PSoC DesignerTM) Full-featured, in-circuit emulator and programmer Full-speed emulation Complex breakpoint structure 128K Trace memory Precision, Programmable Clocking Crystal-less oscillator with support for an external crystal or resonator Internal 5.0% 6/12/24 MHz main oscillator Internal Low speed oscillator at 32 kHz for watchdog and sleep.The frequency range is 19-50 kHz with a 32 kHz typical value. Programmable Pin Configurations 25 mA Sink current on all GPIO Pull up, high Z, open drain, CMOS drive modes on all GPIO Configurable inputs on all GPIO Low-dropout voltage regulator for Port1 pins. Programmable to output 3.0, 2.5 or 1.8V at the I/O pins. Selectable, regulated digital IO on Port 1 * Configurable Input Threshold for Port 1 * 3.0V, 20 mA Total Port 1 source current * Hot-Swappable 5 mA Strong drive mode on Ports 0 and 1 Additional System Resources Configurable communication speeds 2 I CTM Slave * Selectable to 50 kHz, 100 kHz, or 400 kHz * Implementation requires no clock stretching * Implementation during sleep modes with less than 100 mA * Hardware address detection SPI master and SPI slave * Configurable between 46.9 kHz-3 MHz Three 16-bit timers 10-bit ADC for monitoring battery voltage or other signals Watchdog and sleep timers Integrated supervisory circuit enCoRe V LV - Block Diagram enCoRe V Low Voltage CORE Port 4 Port 3 Port 2 Port 1 Port 0 Prog. LDO System Bus SRAM 2048 Bytes Interrupt Controller SROM Flash 32K Sleep and Watchdog CPU Core (M8C) 6/12/24 MHz Internal Main Oscillator 3 16-Bit Timers I2C Slave/SPI Master-Slave POR and LVD System Resets SYSTEM RESOURCES Cypress Semiconductor Corporation Document Number: 001-12395 Rev. *E * 198 Champion Court * San Jose, CA 95134-1709 * 408-943-2600 Revised October 17, 2007 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Functional Overview The enCoRe V LV family of devices are designed to replace multiple traditional low voltage microcontroller system components with one, low cost single-chip programmable component. Communication peripherals (I2C/SPI), a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts. The architecture for this device family, as illustrated (enCoRe V LV - Block Diagram), is comprised of two main areas: the CPU core and the system resources. Depending on the enCoRe V LV package, up to 36 general purpose IO (GPIO) are also included. Enhancements over the Cypress' legacy low voltage microcontrollers include faster CPU at lower voltage operation, lower current consumption, twice the RAM and Flash, hot-swapable IOs, I2C hardware address recognition, new very low current sleep mode, and new package options. (Power On Reset) circuit eliminates the need for a system supervisor. * The 5V maximum input, 1.8/2.5/3V-selectable output, low-dropout regulator (LDO) provides regulation for IOs. A register-controlled bypass mode allows the user to disable the LDO. * Standard Cypress PSoC IDE tools are available for debugging the enCoRe V LV family of parts. Getting Started The quickest path to understanding the enCoRe V LV silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the enCoRe V LV integrated circuit and presents specific pin, register, and electrical specifications. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest enCoRe V LV device data sheet on the web at http://www.cypress.com. The enCoRe V LV Core The enCoRe V LV Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard architecture microprocessor. System Resources provide additional capability, such as a configurable I2C slave/SPI master-slave communication interface and various system resets supported by the M8C. Development Kits Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store contains development kits, C compilers, and all accessories for PSoC development. Go to the Cypress Online Store web site at http://www.cypress.com, click the Online Store shopping cart icon at the bottom of the web page, and click USB (Universal Serial Bus) to view a current list of available items. Additional System Resources System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. Brief statements describing the merits of each system resource are presented below. * 10-bit on-chip ADC shared between System Performance manager (used to calculate parameters based on temperature for flash write operations) and the user. * The I2C slave/SPI master-slave module provides 50/100/400 kHz communication over two wires. SPI communication over 3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a slower system clock). In I2C Slave mode the hardware address recognition feature reduces the already low power consumption by eliminating the need for CPU intervention until a packet addressed to the target device has been received. * Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR Technical Training Free enCoRe V LV microcontrollers technical training is available for beginners and is taught by a marketing or application engineer over the phone. Low-Voltage microcontroller training classes cover designing, debugging, analog, as well as application-specific classes covering topics such as PSoC, USB and the LIN bus. Go to http://www.cypress.com, click on Design Support located on the left side of the web page, and select Technical Training for more details. Consultants Certified Cypress consultants offer everything from technical assistance to completed microcontroller designs. To contact or become a Cypress PSoC/USB/microcontroller consultant go to http://www.cypress.com, click on Design Support located on the left side of the web page, and select CYPros Consultants. Technical Support Cypress application engineers take pride in fast and accurate response. They can be reached with a 4-hour guaranteed response at http://www.cypress.com/support/login.cfm. Document Number: 001-12395 Rev. *E Page 2 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Development Tools PSoC Designer is a Microsoft(R) Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE and application runs on Windows NT 4.0, Windows 2000, Windows Millennium (Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.) PSoC Designer helps the customer to select an operating configuration for the microcontroller, write application code that uses its resources, and debug the application. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and the CYASM macro assembler for the CPUs. PSoC Designer also supports a high-level C language compiler developed specifically for the devices in the family. Figure 1. PSoC Designer Subsystems between different sets of enCoRe V LV block configurations at run time. PSoC Designer can print out a configuration sheet for a given project configuration for use during application programming in conjunction with the Device Data Sheet. Once the framework is generated, the user can add application-specific code to flesh out the framework. It's also possible to change the selected components and regenerate the framework. Application Editor In the Application Editor you can edit your C language and Assembly language source code. You can also assemble, compile, link, and build. Assembler. The macro assembler allows the assembly code to be merged seamlessly with C code. The link libraries automatically use absolute addressing or can be compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compiler. A C language compiler is available that supports the enCoRe V LV family of devices. Even if you have never worked in the C language before, the product quickly allows you to create complete C programs for the enCoRe V LV family devices. The embedded, optimizing C compiler provides all the features of C tailored to the enCoRe V LV architecture. It comes complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing the designer to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read the program and read and write data memory, read and write IO registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started. PSoC Designer Software Subsystems Device Editor The device editor subsystem allows the user to select different onboard analog and digital components called user modules using the enCoRe V LV device blocks. Examples of user modules are timers, 10-bit ADC, SPI/I2C etc. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time. PSoC Designer sets up power-on initialization tables for selected enCoRe V LV block configurations and creates source code for an application framework. The framework contains software to operate the selected components and, if the project uses more than one operating configuration, contains routines to switch Hardware Tools In-Circuit Emulator A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with most Cypress USB devices and all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the enCoRe V LV in the target board and performs full speed (24 MHz) operation. Page 3 of 26 Document Number: 001-12395 Rev. *E [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Designing with User Modules To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a feature where the resources of the part can be selected as user modules. For example, the timers, I2C, SPI resources are available as user modules. User modules make selecting and implementing peripheral devices simple and easy. Each user module establishes the basic register settings that implement the selected function. It also provides parameters that allow you to tailor its precise configuration to your particular application. User modules also provide tested software to cut your development time. The user module application programming interface (API) provides high-level functions to control and respond to hardware events at run time. The API also provides optional interrupt service routines that you can adapt as needed. The API functions are documented in user module data sheets that are viewed directly in the PSoC Designer IDE. These data sheets explain the internal operation of the user module and provide performance specifications. Each data sheet describes the use of each user module parameter and documents the setting of each register controlled by the user module. The development process starts when you open a new project and bring up the Device Editor, a graphical user interface (GUI) for configuring the hardware. You pick and place the user modules you need for your project. The tool automatically builds signal chains by connecting user modules to the default IO pins or as required. At this stage, you also configure the clock source connections and enter parameter values directly or by selecting values from drop-down menus. When you are ready to test the hardware configuration or move on to developing code for the project, you perform the "Generate Application" step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the high-level user module API functions. Figure 2. User Module and Source Code Development Flows Device Editor User Module Selection Source Code Generator Generate Application Application Editor Project Manager Source Code Editor Build Manager Build All Debugger Interface to ICE Storage Inspector Event & Breakpoint Manager The next step is to write your main program, and any sub-routines using PSoC Designer's Application Editor subsystem. The Application Editor includes a Project Manager that allows you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor provides syntax coloring and advanced edit features for both C and assembly language. File search capabilities include simple string searches and recursive "grep-style" patterns. A single mouse click invokes the Build Manager. It employs a professional-strength "makefile" system to automatically analyze all file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies used by the compiler and linker. Syntax errors are displayed in a console window. Double clicking the error message takes you directly to the offending line of source code. When all is correct, the linker builds a HEX file image suitable for programming. The last step in the development process takes place inside the PSoC Designer's Debugger subsystem. The Debugger downloads the HEX image to the In-Circuit Emulator (ICE) where it runs at full speed. Debugger capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the Debugger provides a large trace buffer and allows you define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals. Document Number: 001-12395 Rev. *E Page 4 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Document Conventions Acronyms Used The following table lists the acronyms that are used in this document. Acronym API CPU GPIO GUI ICE ILO IMO IO LSb LVD MSb POR PPOR PSoC(R) SLIMO SRAM Description application programming interface central processing unit general purpose IO graphical user interface in-circuit emulator internal low speed oscillator internal main oscillator input/output least-significant bit low voltage detect most-significant bit power on reset precision power on reset Programmable System-on-ChipTM slow IMO static random access memory Units of Measure A units of measure table is located in the Electrical Specifications section. Table 4 on page 14 lists all the abbreviations used to measure the enCoRe V LV devices. Numeric Naming Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexidecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (e.g., 01010100b' or `01000011b'). Numbers not indicated by an `h', `b', or 0x are decimal. Document Number: 001-12395 Rev. *E Page 5 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Pin Configuration 32-Pin Part Pinout Figure 3. CY7C60445 32-Pin enCoRe V LV Device P0[3] P0[7] Vdd P0[6] 28 27 P0[4] 26 32 31 30 P0[5] 29 P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] 1 2 3 4 5 6 7 8 25 P0[2] Vss 24 23 P0[0] P2[6] P2[4] P2[2] P2[0] P3[2] P3[0] XRES QFN (Top View) 9 10 11 12 13 14 15 P1[4] P1[5] P1[1] P1[3] P1[0] Vss P1[2] Table 1. 32-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Type IOH IO IO IO IO IO IO IOHR IOHR IOHR IOHR Power IOHR IOHR Name P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1](1) Vss P1[0](1) P1[2] Digital IO Digital IO Digital IO, Crystal Out (Xout) Digital IO, Crystal In (Xin) Digital IO Digital IO Digital IO Digital IO, I2C SCL, SPI SS Digital IO, I2C SDA, SPI MISO Digital IO, SPI CLK Digital IO, ISSP CLK, I2C SCL, SPI MOSI Ground connection Digital IO, ISSP DATA, I2C SDA, SPI CLK Digital IO Description Note 1. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR). Document Number: 001-12395 Rev. *E P1[6] 16 22 21 20 19 18 17 Page 6 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Table 1. 32-Pin Part Pinout (QFN) (continued) Pin No. 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 CP Type IOHR IOHR Reset Input IO IO IO IO IO IO IOH IOH IOH IOH Power IOH IOH IOH Power Power Name P1[4] P1[6] XRES P3[0] P3[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] Vss Vss Digital IO Active high external reset with internal pull down Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Supply voltage Digital IO Digital IO Digital IO Ground connection Center pad must be connected to ground Description Digital IO, optional external clock input (EXTCLK) LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Document Number: 001-12395 Rev. *E Page 7 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x 48-Pin Part Pinout Figure 4. CY7C60455/CY7C60456 48-Pin enCoRe V LV Device P0[4] 39 P0[2] 38 P0[3] P0[5] P0[7] P0[1] 48 47 46 45 44 43 42 41 NC NC 40 P0[6] 37 NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] 1 2 3 4 5 6 7 8 9 P0[0] 36 35 34 33 32 Vdd Vss P2[6] P2[4] P2[2] P2[0] P4[2] P4[0] P3[6] P3[4] P3[2] P3[0] XRES P1[6] QFN (Top View) 31 30 29 28 27 26 25 10 11 12 13 14 15 16 17 18 19 20 21 22 P1[0] 23 24 P1[2] P1[3] P1[1] P1[5] Table 2. 48-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Type NC IO IO IO IO IO IO IO IO IO IO IOHR IOHR NC NC NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] NC NC Name No connection Digital I/O Digital I/O, Crystal Out (Xout) Digital I/O, Crystal In (Xin) Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, I2C SCL, SPI SS Digital I/O, I2C SDA, SPI MISO No connection No connection Description Document Number: 001-12395 Rev. *E P1[4] NC NC Vss NC Vdd NC Page 8 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Table 2. 48-Pin Part Pinout (QFN) (continued) Pin No. 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 CP Type IOHR IOHR Power NC NC Power IOHR IOHR IOHR IOHR XRES IO IO IO IO IO IO IO IO IO IO IOH IOH IOH IOH Power NC NC IOH IOH IOH Power IOH Power Name P1[3] P1[1] Vss NC NC Vdd P1[0] P1[2] P1[4] P1[6] Ext Reset P3[0] P3[2] P3[4] P3[6] P4[0] P4[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd NC NC P0[7] P0[5] P0[3] Vss P0[1] Vss (2) (2) Description Digital I/O, SPI CLK Digital I/O, ISSP CLK, I2C SCL, SPI MOSI Supply ground No connection No connection Supply voltage Digital I/O, ISSP DATA, I2C SDA, SPI CLK Digital I/O Digital I/O, optional external clock input (EXTCLK) Digital I/O Active high external reset with internal pull down Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Supply voltage No connection No connection Digital I/O Digital I/O Digital I/O Supply ground Digital I/O Center pad must be connected to ground LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Note 2. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR). Document Number: 001-12395 Rev. *E Page 9 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Register Reference The section discusses the registers of the enCoRe V LV device. It lists all the registers in mapping tables, in address order. Register Mapping Tables The enCoRe V LV device has a total register address space of 512 bytes. The register space is also referred to as IO space and is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set, the user is said to be in the "extended" address space or the "configuration" registers. Register Conventions The register conventions specific to this section and the Register Reference chapter are listed in the following table. Table 3. Register Conventions Convention R W O L C # Description Read register or bits Write register or bits Only a read/write register or bits Logical register or bits Clearable register or bits Access is bit specific Register Map Bank 0 Table: User Space Addr Addr Name Access Name (0,Hex) Access (0,Hex) PRT0DR 00 RW 40 PRT0IE 01 RW 41 02 42 03 43 PRT1DR 04 RW 44 PRT1IE 05 RW 45 06 46 07 47 PRT2DR 08 RW 48 PRT2IE 09 RW 49 0A 4A 0B 4B PRT3DR 0C RW 4C PRT3IE 0D RW 4D 0E 4E 0F 4F PRT4DR 10 RW 50 PRT4IE 11 RW 51 12 52 13 53 14 54 15 55 16 56 17 57 18 58 19 59 1A 5A 1B 5B 1C 5C 1D 5D 1E 5E 1F 5F 20 60 21 61 22 62 23 63 Gray fields are reserved and should not be accessed. # Access is bit specific. Name Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 Access Name Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 Access I2C_XCFG I2C_XSTAT I2C_ADDR I2C_BP I2C_CP CPU_BP CPU_CP I2C_BUF CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK2 INT_MSK1 INT_MSK0 INT_SW_EN INT_VC RES_WDT RW R RW R R RW R RW RW RW RW RW RW RW # RW RW RW RW RW RW RW RW RW RC W Document Number: 001-12395 Rev. *E Page 10 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Addr Addr Name Access Name (0,Hex) Access (0,Hex) 24 64 25 65 26 66 27 67 28 68 SPI_TXR 29 W 69 SPI_RXR 2A R 6A SPI_CR 2B # 6B 2C 6C 2D 6D 2E 6E 2F 6F 30 70 PT0_CFG 31 71 PT0_DATA1 32 72 PT0_DATA0 33 73 PT1_CFG 34 74 PT1_DATA1 35 75 PT1_DATA0 36 76 PT2_CFG 37 77 PT2_DATA1 38 78 PT2_DATA0 39 79 3A 7A 3B 7B 3C 7C 3D 7D 3E 7E 3F 7F Gray fields are reserved and should not be accessed. # Access is bit specific. Name Addr (0,Hex) A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF Access Name INT_MSK3 RW RW RW RW RW RW RW RW RW CPU_F CPU_SCR1 CPU_SCR0 Addr (0,Hex) E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RL # # Document Number: 001-12395 Rev. *E Page 11 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Register Map Bank 1 Table: Configuration Space Addr Addr Access Name Access Name (1,Hex) (1,Hex) PRT0DM0 00 RW 40 PRT0DM1 01 RW 41 02 42 03 43 PRT1DM0 04 RW 44 PRT1DM1 05 RW 45 06 46 07 47 PRT2DM0 08 RW 48 PRT2DM1 09 RW 49 0A 4A 0B 4B PRT3DM0 0C RW 4C PRT3DM1 0D RW 4D 0E 4E 0F 4F PRT4DM0 10 RW 50 PRT4DM1 11 RW 51 12 52 13 53 14 54 15 55 16 56 17 57 18 58 19 59 1A 5A 1B 5B 1C 5C 1D 5D 1E 5E 1F 5F 20 60 21 61 22 62 23 63 24 64 25 65 26 66 27 67 28 68 SPI_CFG 29 RW 69 2A 6A 2B 6B 2C TMP_DR0 6C RW 2D TMP_DR1 6D RW 2E TMP_DR2 6E RW 2F TMP_DR3 6F RW 30 70 31 71 32 72 33 73 34 74 35 75 36 76 37 77 38 78 39 79 Gray fields are reserved and should not be accessed. # Access is bit specific. Name Addr (1,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 Access Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB IO_CFG DC OUT_P1 DD DE DF OSC_CR0 E0 ECO_CFG E1 OSC_CR2 E2 VLT_CR E3 VLT_CMP E4 E5 E6 E7 IMO_TR E8 ILO_TR E9 EA SLP_CFG EB SLP_CFG2 EC SLP_CFG3 ED EE EF F0 F1 F2 F3 F4 F5 F6 CPU_F F7 F8 F9 Name Access RW RW RW # RW RW R W W RW RW RW RL Document Number: 001-12395 Rev. *E Page 12 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Addr Addr Name Access Name (1,Hex) Access (1,Hex) 3A 7A 3B 7B 3C 7C 3D 7D 3E 7E 3F 7F Gray fields are reserved and should not be accessed. # Access is bit specific. Name Addr (1,Hex) BA BB BC BD BE BF Access Name Addr (1,Hex) FA FB FC FD FE FF Access Document Number: 001-12395 Rev. *E Page 13 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Electrical Specifications This chapter presents the DC and AC electrical specifications of the enCoRe V LV devices. For the most up to date electrical specifications, verify that you have the most recent data sheet available by visiting the company web site at http://www.cypress.com Figure 5. Voltage versus CPU Frequency 3.6V The following table lists the units of measure that are used in this chapter. Table 4. Units of Measure Symbol o C dB fF Hz KB Kbit kHz k MHz M A F H s V Vrms W mA ms mV nA ns nV W pA pF pp ppm ps sps s V Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts lid ng Va rati n pe gio Re O 1.71V Vdd Voltage 750 kHz 3 MHz CPU Frequency 24 MHz Figure 6. IMO Frequency Trim Options 3.6V Vdd Voltage SLIMO Mode = 01 SLIMO Mode = 00 SLIMO Mode = 10 1.71V 750 kHz 3 MHz 6 MHz 12 MHz 24 MHz IMO Frequency Document Number: 001-12395 Rev. *E Page 14 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Electrical Characteristics Absolute Maximum Ratings Storage Temperature (TSTG) (3) ............................................. ...................................................... -55oC to 125oC (Typical +25oC) Supply Voltage Relative to Vss (Vdd) .................................... ................................................................................. -0.5V to +4.0V DC Input Voltage (VIO)........................................................... ................................................................. Vss - 0.5V to Vdd + 0.5V DC Voltage Applied to Tri-state (VIOZ) ................................... ................................................................. Vss - 0.5V to Vdd + 0.5V Maximum Current into any Port Pin (IMIO)............................. ............................................................................. -25mA to +50mA Electro Static Discharge Voltage (ESD) (4) ............................ .............................................................................................. 2000V Latch-up Current (LU) (5) ....................................................... ............................................................................................. 200mA Operating Conditions Ambient Temperature (TA) ..................................................... .....................................................................................0oC to 70oC Operational Die Temperature (TJ)(6) ...................................... .....................................................................................0oC to 85oC DC Electrical Characteristics DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Parameter Vdd IDD24 Description Supply Voltage Supply Current, IMO = 24 MHz Conditions See table titled DC POR and LVD Specifications on page 19. Conditions are Vdd = 3.0V, TA = 25oC, CPU = 24 MHz No I2C/SPI Conditions are Vdd = 3.0V, TA = 25oC, CPU = 12 MHz No I2C/SPI Conditions are Vdd = 3.0V, TA = 25oC, CPU = 6 MHz No I2C/SPI Vdd = 3.0V, TA = 25oC, IO regulator turned off Vdd = 3.0V, TA = 25oC, IO regulator turned off Min 1.71 - Typ - - Max 3.6 2.15 Units V mA IDD12 Supply Current, IMO = 12 MHz - - 1.45 mA IDD6 Supply Current, IMO = 6 MHz - - 1.1 mA ISB0 ISB1 Deep Sleep Current Standby Current with POR, LVD and Sleep Timer - - 0.1 - - 1.5 A A Notes 3. Higher storage temperatures reduce data retention time. Recommended Storage Temperature is +25C 25C. Extended duration storage temperatures above 85C degrade reliability. 4. Human Body Model ESD. 5. Per JESD78 standard. 6. The temperature rise from ambient to junction is package specific. See "Package Diagram" on page 23 for Thermal Impedances. The user must limit the power consumption to comply with this requirement. Document Number: 001-12395 Rev. *E Page 15 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x DC General Purpose IO Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 1.71V to 3.6V and 0C TA 70C. Typical parameters apply to 3.3V at 25C and are for design guidance only. Table 5. 3.0V to 3.6V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 Description Pull up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out IOH < 10 A, maximum of 10 mA source current in all IOs IOH = 1 mA, maximum of 20 mA source current in all IOs IOH < 10 A, maximum of 10 mA source current in all IOs IOH = 5 mA, maximum of 20 mA source current in all IOs IOH < 10 A, Vdd > 3.1V, maximum of 4 IOs all sourcing 5 mA IOH = 5 mA, Vdd > 3.1V, maximum of 20 mA source current in all IOs Conditions Min 4 Vdd - 0.2 Vdd - 0.9 Vdd - 0.2 Typ 5.6 - - - Max 8 - - - Units k V V V VOH4 Vdd - 0.9 - - V VOH5 2.85 3.00 3.15 V VOH6 2.20 - - V VOH7 High Output Voltage IOH < 10 A, Vdd > 2.7V, maximum of Port 1 Pins with LDO Enabled for 2.5V 20 mA source current in all IOs Out High Output Voltage IOH = 2 mA, Vdd > 2.7V, maximum of Port 1 Pins with LDO Enabled for 2.5V 20 mA source current in all IOs Out IOH < 10 A, Vdd > 2.7V, maximum of High Output Voltage Port 1 Pins with LDO Enabled for 1.8V 20 mA source current in all IOs Out High Output Voltage IOH = 1 mA, Vdd > 2.7V, maximum of Port 1 Pins with LDO Enabled for 1.8V 20 mA source current in all IOs Out Low Output Voltage IOL = 25 mA, Vdd > 3.3V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]) 2.35 2.50 2.65 V VOH8 1.90 - - V VOH9 1.60 1.80 2.00 V VOH10 1.20 - - V VOL - - 0.75 V VIL VIH VH IIL CIN COUT Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output Package and pin dependent Temp = 25oC Package and pin dependent Temp = 25oC - 2.00 - - 0.5 0.5 - - 80 1 1.7 1.7 0.80 - 25 5 5 V V mV nA pF pF Document Number: 001-12395 Rev. *E Page 16 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Table 6. 2.4V to 3.0V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 Description Pull up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out Low Output Voltage Conditions IOH < 10 A, maximum of 10 mA source current in all IOs IOH = 0.2 mA, maximum of 10 mA source current in all IOs IOH < 10 A, maximum of 10 mA source current in all IOs IOH = 2 mA, maximum of 10 mA source current in all IOs IOH < 10 A, Vdd > 2.4V, maximum of 20 mA source current in all IOs. IOH = 1 mA, Vdd > 2.4V, maximum of 20 mA source current in all IOs IOL = 10 mA, maximum of 30 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) Min 4 Vdd - 0.2 Vdd - 0.4 Vdd - 0.2 Typ 5.6 - - - Max 8 - - - Units k V V V VOH4 Vdd - 0.5 - - V VOH5A 1.50 1.80 2.00 V VOH6A 1.20 - - V VOL - - 0.75 V VIL VIH VH IIL CIN COUT Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output Gross tested to 1 A. Package and pin dependent Temp = 25oC Package and pin dependent Temp = 25oC - 2.0 - - 0.5 0.5 - - 80 1 1.7 1.7 0.72 - - 5 5 V V mV nA pF pF Document Number: 001-12395 Rev. *E Page 17 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Table 7. 1.71V to 2.4V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 Description Pull up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 Low Output Voltage IOH = 10 A, maximum of 10 mA source current in all IOs IOH = 0.5 mA, maximum of 10 mA source current in all IOs IOH = 100 A, maximum of 10 mA source current in all IOs IOH = 2 mA, maximum of 10 mA source current in all IOs IOL = 5 mA, maximum of 20 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) Conditions Min 4 Vdd - 0.2 Vdd - 0.5 Vdd - 0.2 Typ 5.6 - - - Max 8 - - - Units k V V V VOH4 Vdd - 0.5 - - V VOL - - 0.4 V VIL VIH VH IIL CIN COUT Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output Package and pin dependent. Temp = 25oC Package and pin dependent Temp = 25oC - 0.65 x Vdd - - 0.5 0.5 - - 80 1 0.3 x Vdd - 50 5 5 V V mV nA pF pF Document Number: 001-12395 Rev. *E Page 18 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 8. DC POR and LVD Specifications Symbol VPPOR0 VPPOR1 VPPOR2 VPPOR3 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 Description Vdd Value for PPOR Trip PORLEV[1:0] = 00b, HPOR = 0 PORLEV[1:0] = 00b, HPOR = 1 PORLEV[1:0] = 01b, HPOR = 1 PORLEV[1:0] = 10b, HPOR = 1 Vdd Value for LVD Trip VM[2:0] = 000b(8) VM[2:0] = 001b(9) VM[2:0] = 010b(10) VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b(11) (7) Min 1.61 Typ 1.66 2.36 2.60 2.82 2.45 2.71 2.92 3.02 3.13 1.9 1.8 Max 1.71 2.40 2.65 2.95 2.51 2.78 2.99 3.09 3.20 - - Units V V V V V V V V 2.40 2.64 2.85 2.95 3.06 - - DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 9. DC Programming Specifications Symbol VddIWRITE IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashDR Description Supply Voltage for Flash Write Operations Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify(12) Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify(13) Output Low Voltage During Programming or Verify Output High Voltage During Programming or Verify Flash Write Endurance(14) Flash Data Retention(15) Min 1.71 - - VIH - - - Vdd - 1.0 50,000 10 Typ - 5 - - - - - - - 20 Max - 25 VIL - 0.2 1.5 Vss + 0.75 Vdd - - Units V mA V V mA mA V V Cycles Years Notes 7. Vdd must be greater than or equal to 1.71V during startup, reset from the XRES pin, or reset from Watchdog. 8. Always greater than 50 mV above VPPOR1 for falling supply. 9. Always greater than 50 mV above VPPOR2 for falling supply. 10. Always greater than 50 mV above VPPOR3 for falling supply. 11. Always greater than 50 mV above VPPOR0 voltage for falling supply. 12. Driving internal pull down resistor. 13. Driving internal pull down resistor. 14. Erase/write cycles per block. 15. Following maximum Flash write cycles. Document Number: 001-12395 Rev. *E Page 19 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x AC Electrical Characteristics AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 10. AC Chip-Level Specifications Symbol FMAX FCPU F32K1 FIMO24 FIMO12 FIMO6 DCIMO TRAMP Description Maximum Operating Frequency(16) Maximum Processing Frequency(17) Internal Low Speed Oscillator Frequency Internal Main Oscillator Stability for 24 MHz 5%(18) Internal Main Oscillator Stability for 12 MHz(19) Internal Main Oscillator Stability for 6 MHz(20) Duty Cycle of IMO Supply Ramp Time Min 24 24 30.4 22.8 11.4 5.7 40 0 Typ - - 32 24 12 6.0 50 - Max - - 33.6 25.2 12.6 6.3 60 - Units MHz MHz kHz MHz MHz MHz % s AC General Purpose IO Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 11. Symbol FGPIO AC GPIO Specifications Description GPIO Operating Frequency Conditions Normal Strong Mode, Port 1 Min 0 Typ - Max 6 MHz for 1.8V Vdd = 3.0 to 3.6V, 10% - 90% LDO enabled or disabled. Vdd = 1.71 to 3.0V, 10% - 90% LDO enabled or disabled Vdd = 3.0 to 3.6V, 10% - 90% Vdd = 1.71 to 3.0V, 10% - 90% 7 8 - - 50 80 ns ns TFall TFallL 7 9 - - 50 70 ns ns Notes 16. Digital clocking functions. 17. CPU speed. 18. Trimmed using factory trim values. 19. Trimmed using factory trim values. 20. Trimmed using factory trim values. Document Number: 001-12395 Rev. *E Page 20 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Figure 7. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRise023 TRise1 TFall AC External Clock Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 12. AC External Clock Specifications Symbol FOSCEXT - - - Frequency High Period Low Period Power Up IMO to Switch Description Min 0.750 20.6 20.6 150 Typ - - - - Max 25.2 5300 - - Units MHz ns ns s AC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 13. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK TDSCLK3 TDSCLK2 Description Rise Time of SCLK Fall Time of SCLK Data Set up Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK Data Out Delay from Falling Edge of SCLK Data Out Delay from Falling Edge of SCLK Min 1 1 40 40 0 - - - - - Typ - - - - - - - - - - Max 20 20 - - 8 18 25 45 50 70 Units ns ns ns ns MHz ms ms ns ns ns Document Number: 001-12395 Rev. *E Page 21 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x AC SPI Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. AC SPI Specifications Symbol FSPIM FSPIS TSS Description Maximum Input Clock Frequency Selection, Master Maximum Input Clock Frequency Selection, Slave Width of SS_ Negated Between Transmissions (21) Min - - 50 Typ - - - Max 8.2 4.1 - Units MHz MHz ns AC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 15. AC Characteristics of the I2C SDA and SCL Pins Symbol FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C Description SCL Clock Frequency Hold Time (repeated) START Condition. After this period, the first clock pulse is generated. LOW Period of the SCL Clock HIGH Period of the SCL Clock Set-up Time for a Repeated START Condition Data Hold Time Data Set-up Time Set-up Time for STOP Condition Bus Free Time Between a STOP and START Condition Pulse Width of spikes are suppressed by the input filter Standard Mode Min Max 0 100 4.0 - 4.7 4.0 4.7 0 250 4.0 4.7 - - - - - - - - - Fast Mode Min Max 0 400 0.6 - 1.3 0.6 0.6 0 100(22) 0.6 1.3 0 - - - - - - - 50 Units kHz s s s s s ns s s ns Figure 8. Definition for Timing for Fast/Standard Mode on the I2C Bus SDA TLOWI2C TSUDATI2C THDSTAI2C TSPI2C TBUFI2C SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C Sr TSUSTOI2C P S Notes 21. Output clock frequency is half of input clock rate. 22. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT S 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released. Document Number: 001-12395 Rev. *E Page 22 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Package Diagram This chapter illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the enCoRe V LV emulation tools and their dimensions, refer to the development kit. Packaging Dimensions Figure 9. 32-Lead (5x5 x 0.6 mm) QFN 001-06335 ** Document Number: 001-12395 Rev. *E Page 23 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Figure 10. 48-Lead (7x7 x 1mm) QFN SOLDERABLE EXPOSED PAD NOTES: 1. HATCH AREA IS SOLDERABLE EXPOSED METAL. 2. REFERENCE JEDEC#: MO-220 3. PACKAGE WEIGHT: 0.13g 4. ALL DIMENSIONS ARE IN MM [MIN/MAX] 5. PACKAGE CODE PART # LF48A LY48A DESCRIPTION STANDARD LEAD FREE UNLESS OTHERWISE SPECIFIED ALL DIMENSIONS ARE IN INCHES [MILLIMETERS] STANDARD TOLERANCES ON: ANGLES DECIMALS + + .XX + .XXX + .XXXX DESIGNED BY DRAWN CHK BY APPROVED BY APPROVED BY DATE DATE JSO 02/02/07 DATE CYPRESS COMPANY CONFIDENTIAL TITLE DATE DATE 48LD QFN 7 X 7mm PACKAGE OUTLINE (SUBCON PUNCH TYPE PKG with 5.1 X 5.1 EPAD) PART NO. DWG NO R 001-12919 *A MATERIAL SIZE SEE NOTES 001-12919 Document Number: 001-12395 Rev. *E Page 24 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Thermal Impedances Table 16. Thermal Impedances per Package Package 32 QFN** 48 QFN** Typical JA * 14.5 oC/W 28 oC/W * TJ = TA + Power x JA ** To achieve the thermal impedance specified for the ** package, solder the center thermal pad to the PCB ground plane. Solder Reflow Peak Temperature Following is the minimum solder reflow peak temperature to achieve good solderability. Table 17. Solder Reflow Peak Temperature Package 32 QFN 48 QFN Minimum Peak Temperature* 240oC 240oC Maximum Peak Temperature 260oC 260oC *Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 5oC with Sn-Pb or 245 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications. Ordering Information Ordering Code CY7C60445-32LKXC CY7C60455-48LFXC CY7C60456-48LFXC Package Information 32-lead QFN (5x5x0.6mm) 48-lead QFN (7x7x1mm) 48-lead QFN (7x7x1mm) Flash 16K 16K 32K SRAM 1K 1K 2K No. of GPIOs 28 36 36 Target Applications Feature-Rich Wireless Mouse Mid-Tier Wireless Keyboard Feature-Rich Wireless Keyboard Document Number: 001-12395 Rev. *E Page 25 of 26 [+] Feedback PRELIMINARY CY7C60445, CY7C6045x Document History Page Document Title: CY7C60445, CY7C6045x enCoReTM V Low Voltage Microcontroller Document Number: 001-12395 REV. ** *A *B ECN. 626516 735721 1120504 Issue Date See ECN See ECN See ECN Orig. of Change TYJ TYJ/ARI ARI New data sheet Added new block diagram, replaced TBDs, corrected values, updated pinout information, changed part number to reflect new specifications. Corrected the description to pin 29 on Table 1, the Typ/Max values for ISB0 on the DC chip-level specifications, and the Min voltage value for VddIWRITE in the DC Programming Specifications table. Corrected Flash Write Endurance minimum value in the DC Programming Specifications table. Corrected the Flash Erase Time max value and the Flash Block Write Time max value in the AC Programming Specifications table. Implemented new latest template. Description of Change *C 1225864 See ECN AESA/ARI Corrected the description to pin 13, 29 on Table 1 and 22,44 on Table 2. Added sections Register Reference, Register Conventions and Register Mapping Tables. Corrected Max values on the DC Chip-Level Specifications table. AESA AESA Changed TERASEB parameter, max value to 18ms in Table 13, AC Programming Specification. Post to www.cypress.com *D *E 1446763 1639963 See ECN See ECN (c) Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-12395 Rev. *E Revised October 17, 2007 Page 26 of 26 All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback |
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